The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1982
Filed:
Nov. 12, 1981
Applicant:
Inventors:
Saligrama N Subbarao, Plainsboro, NJ (US);
Ho-Chung Huang, Princeton Junction, NJ (US);
Assignee:
RCA Corporation, New York, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
156643 ; 156150 ; 1562728 ; 156344 ; 156656 ; 204 24 ;
Abstract
A circuit pattern is formed on a front side surface of a semiconductor wafer and an apertured photoresist pattern is formed over the circuit pattern. Via holes are then formed by laser irradiating the wafer at sites corresponding to the photoresist apertures. The back side surface of the wafer is next metallized and this surface is adhered to a plating block by means of an adhesive layer. Electrical connection between the substrate and plating block is then made, the via holes are electroplated, and the substrate is separated from the plating block and adhesive layer.