This inventor holds 2 USPTO granted patents. Top assignee: Disco Corporation. Active years: 2019-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019-2020
Title: Saki Miyakawa: Innovator in Cutting Technology
Introduction
Saki Miyakawa is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of cutting technology, holding a total of 2 patents. Her innovative designs focus on enhancing the efficiency and precision of cutting apparatuses.
Latest Patents
Miyakawa's latest patents include two cutting apparatuses. The first patent describes a cutting apparatus equipped with a cutting blade designed for cutting a workpiece held on a chuck table. This apparatus features an elastic wave detecting sensor that identifies elastic waves generated by the rotation of the cutting blade. It also includes a reference data storing section for maintaining a set of reference processing elastic wave data and reference idling elastic wave data, along with a threshold value storing section, a ratio calculating section, and a determining section.
The second patent also pertains to a cutting apparatus, which consists of a cutting unit that includes a cutting blade with a cutting edge for cutting a dresser board. An elastic wave detection sensor is integrated into the cutting unit to detect elastic waves produced during the cutting process. The sensor generates an output signal that varies as the cutting blade is progressively dressed by the dresser board. A control unit is programmed to store a threshold value, which indicates when the dressing of the cutting blade is complete. When the output signal reaches this threshold, the control unit halts the cutting process and finishes the dressing of the cutting blade.
Career Highlights
Miyakawa is currently employed at Disco Corporation, where she continues to develop innovative cutting technologies. Her work has significantly impacted the efficiency of cutting processes in various industries.
Collaborations
Throughout her career, Saki has collaborated with notable colleagues, including Tomoaki Sugiyama and Takahiko Tsuno. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Saki Miyakawa is a trailblazer in the field of cutting technology, with her patents reflecting her commitment to innovation and precision. Her contributions continue to shape the industry and inspire future advancements in cutting apparatus design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
