Sadayuki Ohkuni

Title: Inventor Spotlight: Sadayuki Ohkuni

Introduction

Sadayuki Ohkuni, based in Fukushima-ken, Japan, is a notable inventor recognized for his innovative contributions to the field of semiconductor processing. With a focus on enhancing precision in surface-grinding methods, Ohkuni's work has significant implications for the manufacturing of semiconductor wafers.

Latest Patents

Ohkuni holds a patent for a "Method and apparatus for surface-grinding of workpiece." This invention addresses critical challenges in semiconductor wafer production, such as correcting waviness and bowing, ultimately leading to wafers with no thickness dispersion. The method achieves higher precision than previously possible while simplifying the processing technique, thus reducing costs. The innovative approach involves fixing the workpiece on a base plate with adhesive material while performing surface grinding on the opposite side.

Career Highlights

Sadayuki Ohkuni is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His contributions to the company's research and development efforts have positioned him as a key player in advancing wafer processing technologies.

Collaborations

Throughout his career, Ohkuni has worked alongside esteemed colleagues including Tadahiro Kato and Hideo Kudo. Their collaborative efforts in research and development have further enhanced the innovative capabilities within their company.

Conclusion

Sadayuki Ohkuni's patent addresses crucial industry needs, showcasing his commitment to innovation in semiconductor processing. His work not only improves production efficiency but also sets new standards for precision in the field. As technology continues to advance, inventors like Ohkuni will play an essential role in shaping the future of semiconductor manufacturing.