Shiga, Japan

Sadaki Tanaka


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: The Innovations of Sadaki Tanaka

Introduction

Sadaki Tanaka is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of integrated circuit packaging. His work has led to advancements that enhance the efficiency and effectiveness of manufacturing processes.

Latest Patents

Tanaka holds a patent for a production device, production method, test apparatus, and integrated circuit package. This innovative manufacturing apparatus is designed to package an integrated circuit chip. The apparatus includes a flattening section that flattens the integrated circuit chip, a holding section that secures a base substrate, a transporting section that moves the flattened chip to the base substrate, and a packaging section that combines the chip and substrate into a complete integrated circuit package. He has 1 patent to his name.

Career Highlights

Tanaka is currently employed at Adv Antest Corporation, where he continues to develop and refine technologies related to integrated circuits. His expertise in manufacturing processes has made him a valuable asset to his company.

Collaborations

Throughout his career, Tanaka has worked alongside talented colleagues, including Yoshinari Kogure and Seiichi Takasu. Their collaborative efforts have contributed to the success of various projects within the company.

Conclusion

Sadaki Tanaka's innovative work in integrated circuit packaging exemplifies the impact of dedicated inventors in the technology sector. His contributions continue to influence manufacturing processes and enhance the efficiency of integrated circuit production.

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