Aichi, Japan

Sachiko Imura

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Toagosei., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sachiko Imura. Retrieved from https://idiyas.com/inventor/sachiko-imura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Sachiko Imura: Inventor in Chemical Mechanical Polishing

Introduction

Sachiko Imura is an inventor associated with Aichi, Japan, and Toagosei Co., Ltd. Her patent work concerns materials used in chemical mechanical polishing.

Latest Patents

Imura is credited with 1 patent, titled “Dispersant and Polishing Agent Composition.” The invention describes a dispersant for chemical mechanical polishing that helps flatten an insulating layer, a wiring layer, or both. It includes a block copolymer with two polymer blocks: one containing structural units derived from specified amide- or ester-group-containing vinyl monomers, and another containing structural units with an ionic functional group.

Career Highlights

The available information connects Imura’s inventive work with Toagosei Co., Ltd. and the development of a polishing-agent composition for semiconductor-related surface processing.

Collaborations

Akihiro Goto and Shun Nakano are identified as Imura’s coworkers. The supplied information does not specify their roles in the patent.

Conclusion

Sachiko Imura’s patent reflects work on dispersant chemistry for chemical mechanical polishing, with an emphasis on compositions designed to flatten insulating and wiring layers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…