Sa-Na Lee

Title: Sa-Na Lee: Innovator in Chemical Mechanical Polishing

Introduction

Sa-Na Lee is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP), particularly in improving the uniformity of polishing processes.

Latest Patents

Sa-Na Lee holds a patent for a method titled "Method for achieving uniform CU CMP polishing." This innovative method focuses on removing a metal oxide overlayer from a target polishing surface during the CMP process. The patent outlines a process that includes providing a substrate with a metal oxide layer, using an oxide removal solution to eliminate this layer, and then performing the CMP process with an abrasive slurry that contains oxidizers and complexing agents.

Career Highlights

Sa-Na Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in enhancing the efficiency and effectiveness of CMP processes, which are critical in semiconductor manufacturing.

Collaborations

Sa-Na Lee has collaborated with notable colleagues, including Tsu Shih and Syun-Ming Jang. These collaborations have contributed to advancements in CMP technology and have fostered a productive research environment.

Conclusion

Sa-Na Lee's innovative work in chemical mechanical polishing has made a significant impact on the semiconductor industry. His contributions continue to influence the development of more efficient polishing techniques.