Kawasaki, Japan

Ryuma Mizusawa

This inventor holds 1 USPTO granted patent. Top assignee: Tokyo Ohka Kogyo., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryuma Mizusawa. Retrieved from https://idiyas.com/inventor/ryuma-mizusawa-q2bvewmf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ryuma Mizusawa: Innovator in Semiconductor Device Production

Introduction

Ryuma Mizusawa is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the efficient production of circuit patterns. His innovative methods have the potential to enhance the manufacturing processes of semiconductor devices.

Latest Patents

Mizusawa holds a patent for a semiconductor device production method. This method allows for the efficient production of circuit patterns, facilitating the effortless pickup of these patterns after dicing. The process involves several steps, including the production of a semiconductor substrate with circuit patterns on a first surface, the formation of laminates using adhesive layers, and the final step of picking up the circuit patterns from a second support.

Career Highlights

Ryuma Mizusawa is associated with Tokyo Ohka Kogyo Co., Ltd., where he has been instrumental in advancing semiconductor production techniques. His work has contributed to the company's reputation as a leader in the semiconductor industry.

Collaborations

Mizusawa has collaborated with notable colleagues, including Yubun Kikuchi and Yoshihiro Yamada. These partnerships have fostered innovation and development within the field of semiconductor technology.

Conclusion

Ryuma Mizusawa's contributions to semiconductor device production exemplify the importance of innovation in technology. His patented methods are paving the way for more efficient manufacturing processes in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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