Ryuki Horie

Title: Innovations by Ryuki Horie in Solder Technology

Introduction

Ryuki Horie is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of solder technology, particularly through his innovative patent related to solder alloys and their applications. His work focuses on enhancing the performance and reliability of solder materials used in various electronic applications.

Latest Patents

Horie holds a patent for a solder alloy, solder paste, solder ball, solder preform, and solder joint. This invention provides a solder composition that maintains a melting temperature within a predetermined range while exhibiting high tensile and shear strength. The solder materials are designed to suppress the generation of voids and ensure excellent mountability due to their thin oxide films. The specific alloy composition includes silver (Ag) ranging from 2.5% to 3.7%, copper (Cu) from 0.25% to 0.95%, bismuth (Bi) from 3.0% to 3.9%, and indium (In) from 0.5% to 2.3%, with the balance being tin (Sn). The composition adheres to specific relations that optimize its performance.

Career Highlights

Horie is associated with Senju Metal Industry Co., Ltd., where he continues to develop innovative solder materials. His expertise in solder technology has positioned him as a key figure in the industry, contributing to advancements that enhance the quality and reliability of electronic components.

Collaborations

Horie collaborates with fellow inventor Yoshie Tachibana, working together to push the boundaries of solder technology and improve the performance of solder materials in various applications.

Conclusion

Ryuki Horie's contributions to solder technology through his innovative patent demonstrate his commitment to advancing the field. His work not only enhances the performance of solder materials but also plays a crucial role in the reliability of electronic devices.