The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Oct. 21, 2022
Senju Metal Industry Co., Ltd., Tokyo, JP;
Yoshie Tachibana, Tokyo, JP;
Ryuki Horie, Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint, which have a melting temperature within a predetermined range, and high tensile strength and shear strength, suppress generation of voids, and have excellent mountability due to their thin oxide films. The solder alloy has an alloy composition consisting of, by mass %, Ag: 2.5 to 3.7%, Cu: 0.25 to 0.95%, Bi: 3.0 to 3.9%, and In: 0.5 to 2.3%, with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 8.1≤Ag+2Cu+Bi+In ≤11.5 (1), and 1.00≤(Bi+In)/Ag≤1.66 (2). Ag, Cu, Bi and In in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.