Ryuji Ueda

Title: Ryuji Ueda: Innovator in Metal Foil Technologies

Introduction

Ryuji Ueda is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of metal foil technologies, holding a total of 6 patents. His innovative work has paved the way for advancements in various applications, particularly in circuit board manufacturing and solar cell modules.

Latest Patents

Ueda's latest patents include several groundbreaking inventions. These are the metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and a method of manufacturing a metal foil pattern layered body. The metal foil pattern layered body invention features a base member, a metal foil with a metal pattern formed by an opening and a metal portion, and a protuberance at the boundary between the opening and the metal portion. Additionally, his method of manufacturing a circuit board involves forming a plurality of metal electrodes on a holding sheet, which are then transcribed onto a base material.

Career Highlights

Throughout his career, Ryuji Ueda has worked with notable companies such as Dsm IP Assets B.V. and Toppan Printing Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements in the industry.

Collaborations

Ueda has collaborated with talented individuals in his field, including Koichi Kumai and Kentaro Kubota. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Ryuji Ueda's contributions to metal foil technologies demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of materials and manufacturing processes, making him a key figure in his field.