Dsm IP Assets B.v.

Toppan Printing Co., Ltd.

Ryuji Ueda

Koichi Kumai

Takehito Tsukamoto

Minoru Kawasaki

Hiroshi Matsuzawa

Takao Tomono

Shingo Akao

Osamu Koga

Fusao Takagi

Shigeki Kudo

Satoshi Tanaka

Yusuke Onoda

Kentaro Kubota

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Method of manufacturing a circuit board by punching

A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

A metal photoetching product comprising at least one large cavity of minor axis WS, major axis WL and depth Din a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of WS, major axis WL, and depth D; and the product satisfies the following dimensions, D+D=plate thickness D, 0.02 mm&#x2266;D&#x2266;2 mm, 0.4&#xd7;D&#x3c;WS&#x3c;D, and 0.2&#xd7;D&#x3c;WS&#x3c;0.8&#xd7;D.

Metal photoetching product and production method thereof

A metal photoetching product comprising at least one large cavity of minor axis WS, major axis WL and depth Din a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of WS, major axis WL, and depth D; and the product satisfies the following dimensions, DDplate thickness D, 0.02 mm&#x2266;D&#x2266;2 mm, 0.4&#xd7;D&#x3c;WS&#x3c;D, and 0.2&#xd7;D&#x3c;WS&#x3c;0.8&#xd7;D.

Growing community of inventors

Tokyo, Japan

Ryuji Ueda