Ryuji Ishizuka

Title: Ryuji Ishizuka: Innovator in Copper-Clad Laminate Technology

Introduction

Ryuji Ishizuka is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the development of double-sided copper-clad laminates. With a total of 2 patents to his name, Ishizuka's work has implications for various electronic applications.

Latest Patents

Ishizuka's latest patents focus on innovative designs for double-sided copper-clad laminates. The first patent describes a laminate that includes an adhesive layer and a copper foil on each surface of a resin film, which is cured at 25° C. This design ensures that each copper foil has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less, measured in accordance with ISO 25178. The second patent also pertains to a double-sided copper-clad laminate intended for capacitors. This laminate is designed to exhibit excellent voltage endurance and peel strength while ensuring high capacitor capacity.

Career Highlights

Ryuji Ishizuka is currently employed at Mitsui Mining & Smelting Company, Ltd. His work at this esteemed company has allowed him to focus on advancing technologies that enhance the performance of electronic components. His innovative approaches have positioned him as a key figure in the industry.

Collaborations

Ishizuka has collaborated with notable coworkers, including Yoshihiro Yoneda and Toshihiro Hosoi. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the field of materials science.

Conclusion

Ryuji Ishizuka's contributions to the field of copper-clad laminates demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material properties and their applications in electronics. As he continues to work at Mitsui Mining & Smelting Company, Ltd., his future endeavors are likely to further impact the industry.