The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Apr. 04, 2023
Applicant:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Inventors:
Ryuji Ishizuka, Ageo, JP;
Yoshihiro Yoneda, Ageo, JP;
Toshihiro Hosoi, Ageo, JP;
Yuji Kageyama, Ageo, JP;
Assignee:
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/14 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); H01G 4/008 (2006.01); H01G 4/35 (2006.01);
U.S. Cl.
CPC ...
H01G 4/14 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); H01G 4/008 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/204 (2013.01); B32B 2307/732 (2013.01); B32B 2457/16 (2013.01); H01G 4/35 (2013.01);
Abstract
A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.