Ogaki, Japan

Ryuichiro Tominaga

This inventor holds 2 USPTO granted patents. Top assignee: Ibiden Company Limited. Active years: 2016-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryuichiro Tominaga. Retrieved from https://idiyas.com/inventor/ryuichiro-tominaga-pzbwruas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2016-2017

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2 patents (USPTO):Explore Patents

Title: Ryuichiro Tominaga: Innovator in Printed Wiring Board Technology

Introduction

Ryuichiro Tominaga is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology. With a total of 2 patents to his name, Tominaga's work has advanced the capabilities and efficiency of electronic components.

Latest Patents

Tominaga's latest patents include innovative designs for printed wiring boards. The first patent describes a printed wiring board that features a substrate with first and second cavities. This design accommodates first electronic components in the first cavity and second electronic components in the second cavity. A build-up layer is formed on the substrate, which includes an insulating interlayer that covers both cavities. The substrate is designed with a first projection structure that partitions the first components in the first cavity and a second projection structure that partitions the second components in the second cavity. The dimensions of these structures are carefully calculated to meet specific criteria.

The second patent also focuses on a printed wiring board, which includes a core substrate with a cavity that houses multiple electronic components. This design features a build-up layer with an insulating interlayer covering the cavity. The components consist of a first, second, and third component, with the core substrate containing projection structures that partition the components within the cavity. Similar to the first patent, the dimensions of the structures are designed to satisfy specific distance and width requirements.

Career Highlights

Ryuichiro Tominaga is currently employed at Ibiden Company Limited, where he continues to innovate in the field of electronic component design. His work has been instrumental in enhancing the functionality and reliability of printed wiring boards.

Collaborations

Tominaga collaborates with Toyotaka Shimabe, a fellow innovator in the industry. Their partnership has fostered advancements in technology and has contributed to the success of their projects.

Conclusion

Ryuichiro Tominaga is a prominent figure in the realm of printed wiring board technology. His patents reflect a commitment to innovation and excellence in electronic design. His contributions continue to shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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