Company Filing History:
Years Active: 2012-2025
Title: Ryoung-Han Kim: Innovator in Integrated Circuit Technology
Introduction
Ryoung-Han Kim is a notable inventor based in Clifton Park, NY (US). He has made significant contributions to the field of integrated circuits, holding a total of 5 patents. His work focuses on enhancing the performance and reliability of multilayer interconnect structures.
Latest Patents
One of Ryoung-Han Kim's latest patents is a multilayer interconnect structure and method for integrated circuits. This innovation involves providing a substrate with a first dielectric that supports a multi-layer interconnection. The structure includes lower conductor M, upper conductor M, a dielectric interlayer (DIL), and an interconnecting via conductor V. The design features a first upper surface of the lower conductor M located in a recess below the second upper surface of the first dielectric. The DIL is formed above these surfaces, and a cavity is etched through the DIL to expose the first surface of the upper conductor M. This cavity is then filled with an additional electrical conductor to create the upper conductor M and the connecting via conductor V, ensuring electrical contact with the first upper surface. This innovative approach lengthens the critical dimension between the lower conductors M and the via conductor V, effectively reducing leakage current and electro-migration.
Career Highlights
Ryoung-Han Kim has worked with prominent companies in the technology sector, including GlobalFoundries Inc. and Tessera Advanced Technologies, Inc. His experience in these organizations has allowed him to refine his expertise in integrated circuit technology and contribute to groundbreaking advancements in the field.
Collaborations
Ryoung-Han Kim has collaborated with various professionals throughout his career, including his coworker Matthew Earl Colburn. These collaborations have played a crucial role in the development of his innovative technologies.
Conclusion
Ryoung-Han Kim is a distinguished inventor whose work in integrated circuit technology has led to significant advancements in multilayer interconnect structures. His contributions continue to influence the field and pave the way for future innovations.