Nagaokakyo, Japan

Ryota Sato

This inventor holds 1 USPTO granted patent. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryota Sato. Retrieved from https://idiyas.com/inventor/ryota-sato-ysrh7efc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ryota Sato and His Patent for a Shielded Module.

Introduction

Ryota Sato is an inventor associated with Murata Manufacturing Co., Ltd. in Nagaokakyo, Japan. His patent work includes a module design that combines component sealing with a grounded shield film.

Latest Patents

Sato is credited with 1 patent. The patent, titled “Module,” describes a substrate with a component mounted on its first surface. Sealing resin covers at least part of the substrate surface and a side surface of the component, while leaving the component’s upper surface exposed. A grounded shield film covers the resin and part of the exposed component surface. The covered region includes a strip-shaped portion with locally reduced surface roughness.

Career Highlights

Sato’s listed patent reflects work on electronic module construction, particularly the arrangement of sealing materials and shielding around mounted components. The patent identifies Murata Manufacturing Co., Ltd. as his company.

Collaborations

Mitsuo Ishido and Minoru Komiyama are listed as Sato’s coworkers. Their names provide context for his professional connections, though the supplied information does not specify their roles in the patent.

Conclusion

Ryota Sato’s patent describes a module that integrates component sealing and grounded shielding, highlighting his contribution to electronic packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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