This inventor holds 1 USPTO granted patent. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ryota Sato and His Patent for a Shielded Module.
Introduction
Ryota Sato is an inventor associated with Murata Manufacturing Co., Ltd. in Nagaokakyo, Japan. His patent work includes a module design that combines component sealing with a grounded shield film.
Latest Patents
Sato is credited with 1 patent. The patent, titled “Module,” describes a substrate with a component mounted on its first surface. Sealing resin covers at least part of the substrate surface and a side surface of the component, while leaving the component’s upper surface exposed. A grounded shield film covers the resin and part of the exposed component surface. The covered region includes a strip-shaped portion with locally reduced surface roughness.
Career Highlights
Sato’s listed patent reflects work on electronic module construction, particularly the arrangement of sealing materials and shielding around mounted components. The patent identifies Murata Manufacturing Co., Ltd. as his company.
Collaborations
Mitsuo Ishido and Minoru Komiyama are listed as Sato’s coworkers. Their names provide context for his professional connections, though the supplied information does not specify their roles in the patent.
Conclusion
Ryota Sato’s patent describes a module that integrates component sealing and grounded shielding, highlighting his contribution to electronic packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile