The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Jan. 30, 2024
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Mitsuo Ishido, Nagaokakyo, JP;

Minoru Komiyama, Nagaokakyo, JP;

Ryota Sato, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/114 (2026.01); H10W 90/00 (2026.01);
Abstract

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin that seals at least a part of the first surface and at least a side surface of the first component; and a shield film that is grounded and covers a surface of the first sealing resin on a side farther from the substrate. A surface of the first component on a side farther from the substrate is exposed from the first sealing resin. When the surface of the first component that is exposed from the first sealing resin is defined as a first exposed surface, the first exposed surface has a region covered with the shield film, the region including a strip-shaped portion that is locally reduced in surface roughness.


Find Patent Forward Citations

Ishido, Mitsuo. (2026). Module (U.S. Patent No. 12765412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765412

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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