Miyagi, Japan

Ryota Koitabashi


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Ryota Koitabashi: Innovator in Substrate Processing Technology

Introduction

Ryota Koitabashi is a prominent inventor based in Miyagi, Japan. He has made significant contributions to the field of substrate processing technology. His innovative work has led to the development of a unique patent that enhances the efficiency of plasma processing systems.

Latest Patents

Ryota Koitabashi holds a patent for a "Substrate processing system and method for installing edge ring." This patent describes a substrate processing system that includes a plasma processing apparatus, a decompression transferrer, and control circuitry. The system is designed to control a transfer robot for loading an edge ring into a process chamber. It also stabilizes the electrostatic clamping of the edge ring before performing plasma processing on a product substrate. This innovative approach includes applying pulsed direct current voltage to the substrate support, which enhances the overall processing efficiency. Ryota has 1 patent to his name.

Career Highlights

Ryota Koitabashi is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing equipment industry. His role involves developing advanced technologies that improve substrate processing methods. His expertise in this area has positioned him as a valuable asset to his organization.

Collaborations

Throughout his career, Ryota has collaborated with notable colleagues, including Takashi Aramaki and Lifu Li. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ryota Koitabashi's contributions to substrate processing technology exemplify the impact of innovative thinking in the semiconductor industry. His patent and work at Tokyo Electron Limited highlight his commitment to advancing technology in this critical field.

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