Tokyo Electron Limited

Ryota Koitabashi

Nobutaka Sasaki

Wataru Shimizu

Lifu Li

Gyeong Min Park

Takashi Aramaki

Shusei Kato

Toshiki Akama

A substrate processing system includes a plasma processing apparatus, a decompression transferrer coupled to the plasma processing apparatus, and control circuitry that controls a transfer robot to load an edge ring into a process chamber and to transfer the edge ring to a lift assembly, controls the lift assembly to lower the edge ring onto a ring support surface, controls an electrostatic chuck to electrostatically clamp the edge ring onto the ring support surface, and controls a plasma generator to generate plasma in the process chamber and stabilize the electrostatically clamping of the edge ring onto the electrostatic chuck before performing plasma processing on a product substrate, the stabilizing includes controlling a power source to apply pulsed direct current voltage to the substrate support, including applying a first bias voltage and applying a second bias voltage higher than the first bias voltage after applying the first bias voltage.

Substrate processing system and method for installing edge ring

Growing community of inventors

Miyagi, Japan

Ryota Koitabashi