Location History:
- Saitama, JP (2005 - 2006)
- Soka, JP (2016)
Company Filing History:
Years Active: 2005-2016
Title: Innovations of Ryota Iwai in Electroless Gold Plating
Introduction
Ryota Iwai is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of materials science, particularly in the area of electroless gold plating. With a total of three patents to his name, Iwai's work focuses on developing solutions that enhance the efficiency and effectiveness of gold plating processes.
Latest Patents
Iwai's latest patents include an electroless gold plating solution designed for forming fine gold structures. This innovative solution allows for the rapid filling of openings in a resist overlying a substrate, particularly those with widths on the order of micrometers, specifically 100 micrometers or smaller. The solution contains a deposition accelerator that facilitates deposition in fine areas, enabling the formation of microfine patterns. Another patent addresses an electroless gold plating solution that is free from cyanide compounds, incorporating a decomposition inhibitor to enhance stability and performance.
Career Highlights
Ryota Iwai is currently employed at Kanto Kagaku Kabushiki Kaisha, where he continues to advance his research and development efforts. His work has garnered attention for its potential applications in various industries, including electronics and materials engineering.
Collaborations
Iwai collaborates with esteemed colleagues such as Masaru Kato and Tomoaki Tokuhisa, contributing to a dynamic research environment that fosters innovation and creativity.
Conclusion
Ryota Iwai's contributions to the field of electroless gold plating exemplify the impact of innovative thinking in materials science. His patents reflect a commitment to advancing technology and improving manufacturing processes.