The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Mar. 10, 2010
Ryota Iwai, Soka, JP;
Tomoaki Tokuhisa, Soka, JP;
Masaru Kato, Soka, JP;
Tokihiko Yokoshima, Tsukuba, JP;
Masahiro Aoyagi, Tsukuba, JP;
Yasuhiro Yamaji, Tsukuba, JP;
Katsuya Kikuchi, Tsukuba, JP;
Hiroshi Nakagawa, Tsukuba, JP;
Ryota Iwai, Soka, JP;
Tomoaki Tokuhisa, Soka, JP;
Masaru Kato, Soka, JP;
Tokihiko Yokoshima, Tsukuba, JP;
Masahiro Aoyagi, Tsukuba, JP;
Yasuhiro Yamaji, Tsukuba, JP;
Katsuya Kikuchi, Tsukuba, JP;
Hiroshi Nakagawa, Tsukuba, JP;
Kanto Kagaku Kabushiki Kaisha, Tokyo, JP;
Abstract
An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 μm or finer is formed therefrom.