Company Filing History:
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Years Active: 2020-2023
Title: Ryo Hiramatsu: Innovator in Semiconductor Bonding Technologies
Introduction
Ryo Hiramatsu is a notable inventor based in Yokkaichi, Japan, recognized for his contributions to semiconductor technologies. He holds three patents that showcase his innovative approaches to wafer bonding and measurement methods.
Latest Patents
Hiramatsu's latest patents include "Electrical overlay measurement methods and structures for wafer-to-wafer bonding." This method involves providing a first wafer with metal bonding pads and alignment diagnostic structures, overlaying it with a second wafer, and measuring electrical parameters to determine overlay offsets before bonding. Another significant patent is "Bonded assembly containing side bonding structures and methods of manufacturing the same." This patent describes a bonded assembly where semiconductor dies are stacked and connected through external bonding pads and connection wires that extend over the sidewalls of the dies.
Career Highlights
Throughout his career, Ryo Hiramatsu has worked with prominent companies in the technology sector, including SanDisk Technologies Inc. and Western Digital Technologies, Inc. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.
Collaborations
Hiramatsu has collaborated with talented individuals in the field, including Takashi Yamaha and Katsuya Kato. These collaborations have likely enhanced his work and contributed to the development of his patented technologies.
Conclusion
Ryo Hiramatsu is a distinguished inventor whose work in semiconductor bonding technologies has made a significant impact in the industry. His innovative patents reflect his expertise and commitment to advancing technology in this field.