The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Mar. 08, 2021
Western Digital Technologies, Inc., San Jose, CA (US);
Ikue Yokomizo, Nagoya, JP;
Michiaki Sano, Ichinomiya, JP;
Kazuto Watanabe, Nagoya, JP;
Hajime Yamamoto, Nagoya, JP;
Takashi Yamaha, Obu, JP;
Koichi Ito, Yokkaichi, JP;
Katsuya Kato, Yokkaichi, JP;
Ryo Hiramatsu, Yokkaichi, JP;
Hiroshi Sasaki, Nagoya, JP;
Akihiro Tobioka, Nagoya, JP;
Liang Li, Shanghai, CN;
WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US);
Abstract
A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.