The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Apr. 02, 2019
Sandisk Technologies Llc, Addison, TX (US);
Michiaki Sano, Ichinomiya, JP;
Takashi Yamaha, Obu, JP;
Koichi Ito, Yokkaichi, JP;
Ikue Yokomizo, Nagoya, JP;
Ryo Hiramatsu, Yokkaichi, JP;
Kazuto Watanabe, Nagoya, JP;
Katsuya Kato, Yokkaichi, JP;
Hajime Yamamoto, Nagoya, JP;
Hiroshi Sasaki, Nagoya, JP;
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Abstract
A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.