This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Ryder Su - Innovator in De-tape Technology
Introduction
Ryder Su is a notable inventor based in Keelung, Taiwan. He has made significant contributions to the field of technology, particularly with his innovative approach to removing sacrificial substructures from support structures. His work is characterized by a focus on efficiency and practicality in engineering solutions.
Latest Patents
Ryder Su holds a patent for a De-tape tool, which outlines a method for removing a sacrificial substructure from a support structure. The patent describes a process that includes receiving the support structure, applying a barrier to the sacrificial substructure, and using a puncture plate to detach the sacrificial substructure effectively. This invention is particularly valuable in scenarios where functioning electrical devices have been removed from the sacrificial substructure.
Career Highlights
Ryder Su is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has garnered attention for its practical applications and potential to improve manufacturing processes.
Collaborations
Ryder has collaborated with notable colleagues, including Chen Liang Chang and Kuo Hui Chang. Their combined expertise contributes to the advancement of technology within their field.
Conclusion
Ryder Su's contributions to the field of technology, particularly through his De-tape tool patent, highlight his innovative spirit and dedication to improving engineering practices. His work continues to influence the semiconductor industry and showcases the importance of inventive solutions in modern technology.