This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2010-2011.
Company Filing History:
Years Active: 2010-2011
Title: Innovations by Ryan P Deschner
Introduction
Ryan P Deschner is an accomplished inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on advanced methods for mask forming and implanting, which are crucial for enhancing the performance of semiconductor devices.
Latest Patents
One of Deschner's latest patents is titled "Mask forming and implanting methods using implant stopping layer." This invention describes methods for forming a mask for implanting a substrate, utilizing an implant stopping layer with a photoresist. The approach results in lower aspect ratio masks that minimize damage to trench isolations during mask removal. The method involves depositing an implant stopping layer over the substrate, followed by a photoresist layer. A pattern is then formed in the photoresist, which is transferred into the implant stopping layer through etching. The materials used for the implant stopping layer include hydrogenated germanium carbide, nitrogenated germanium carbide, fluorinated germanium carbide, and amorphous germanium carbon hydride. This innovation reduces scattering during implanting due to the higher density of the mask compared to conventional options.
Another notable patent is "Variable fill and cheese for mitigation of BEOL topography." This method focuses on designing features on a semiconductor wafer, specifically for chiplets separated by kerf areas. The process includes determining the pattern density of chiplet features and applying a pattern of spaced dummy features in areas not covered by active features. The size of the dummy features is adjusted until the desired pattern density is achieved.
Career Highlights
Ryan P Deschner is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in semiconductor technology. His work has significantly impacted the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Deschner collaborates with talented individuals such as Todd Christopher Bailey and Katherina E Babich, contributing to a dynamic and innovative work environment.
Conclusion
Ryan P Deschner's contributions to semiconductor technology through his patents and work at IBM highlight his role as a leading inventor in the field. His innovative methods are paving the way for advancements in semiconductor manufacturing.