Fort Wayne, IN, United States of America

Ryan Krauskopf

This inventor holds 1 USPTO granted patent. Top assignee: D&w Fine Pack LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan Krauskopf. Retrieved from https://idiyas.com/inventor/ryan-krauskopf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ryan Krauskopf: Inventor of a Food Storage Assembly

Introduction

Ryan Krauskopf is an inventor based in Fort Wayne, Indiana. His patent work includes a food storage assembly designed to hold layered food items. Krauskopf is associated with D&W Fine Pack LLC and has 1 patent listed in the information provided.

Latest Patents

Krauskopf’s patent, “Food Storage Assembly and Insert for Layered Food Items,” describes a container with a base, an opening, a rim, and a side wall. It also features an insert with a base and two or more flexible side portions extending radially from it. When placed inside the container, the side portions fold to form a wall that conforms to the container’s shape. The design provides an insert for storing layered foods within the container.

Career Highlights

Krauskopf’s documented invention focuses on practical food packaging and storage. His work is associated with D&W Fine Pack LLC, a company connected to the food packaging industry.

Collaborations

The available information identifies D&W Fine Pack LLC as Krauskopf’s company affiliation. No additional collaborators are specified in the provided details.

Conclusion

Ryan Krauskopf’s patent describes a flexible insert that fits the shape of a food container, reflecting his contribution to food storage and packaging design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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