Company Badge
USPTO Data Jan 1 1976 - Nov 3 2026
16 Patents
#19 in Elk Grove Village, IL
#1,014 in Illinois
#19,954 in US
#37,914 in the World
D&w Fine Pack LLC
Forward Citations = 282
21 inventors:
Elk Grove Village, IL, United States of America
D&w Fine Pack LLC
Calculating rank
Trademarks = 31
Forward Citations = 282
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21 inventors (with patents filed for the assignee):
George A Golota (8 out of 54 patents)
John E Sanfilippo (5 out of 82 patents)
Andrei Voityna (4 out of 12 patents)
4. Michael A Drozek (3 out of 17 patents)
5. James J Sanfilippo (2 out of 117 patents)
6. Francisco Javier Soria (2 out of 27 patents)
7. Roman Forowycz (2 out of 20 patents)
8. Scott Rhea (2 out of 2 patents)
9. Richard M Collins (1 out of 5 patents)
10. Steve Pace (1 out of 1 patent)
11. Andrei Voitnya (1 out of 1 patent)
12. Roland R Stephens (1 out of 1 patent)
13. Masaya Kosaka (1 out of 1 patent)
14. Hideki Yokotani (1 out of 1 patent)
15. Reiichhi Konishi (1 out of 1 patent)
16 patents:
Company Overview
D&W Fine Pack LLC is a leading provider of packaging solutions, specializing in the development and manufacturing of high-quality food packaging products. The company focuses on innovative materials and designs that enhance food safety and extend shelf life, catering primarily to the food service and retail sectors. With a commitment to sustainability, D&W Fine Pack integrates eco-friendly practices into its operations, serving clients across North America from its headquarters in Elk Grove Village, Illinois.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: D&w Fine Pack LLC. Retrieved from https://idiyas.com/company/d-and-w-fine-pack
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]