Tempe, AZ, United States of America

Ryan Gunckel

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2024

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3 patents (USPTO):Explore Patents

Title: Ryan Gunckel: Innovator in Stress-Responsive Composites

Introduction

Ryan Gunckel is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of composite materials, particularly in the development of stress-responsive composites. With a total of 3 patents to his name, Gunckel's work is paving the way for innovative applications in material science.

Latest Patents

One of Gunckel's latest patents focuses on stress-responsive composites. This composite material includes a matrix material, a fiber dispersed within the matrix, and an ultraviolet (UV)-light sensitive mechanophore grafted to the fiber's surface. The method for creating this fiber-reinforced polymer composite involves several steps. It begins with contacting a fiber in a first solution, followed by rinsing and drying the intermediate fiber. The dried fiber is then contacted in a third solution, rinsed again, and dried to produce a functionalized fiber that is sensitive to ultraviolet light. This functionalized fiber can be combined with a polymer matrix material, cured, and irradiated to generate a fiber-reinforced polymer composite.

Career Highlights

Ryan Gunckel is affiliated with Arizona State University, where he continues to advance his research in composite materials. His innovative approach to material science has garnered attention in academic and industrial circles alike.

Collaborations

Gunckel collaborates with esteemed colleagues such as Aditi Chattopadhyay and Bonsung Koo, contributing to a dynamic research environment that fosters innovation.

Conclusion

Ryan Gunckel's work in stress-responsive composites exemplifies the intersection of creativity and scientific inquiry. His contributions are not only advancing the field of material science but also opening new avenues for practical applications.

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