Russell J Elias

Title: The Innovations of Russell J Elias

Introduction

Russell J Elias is a notable inventor based in Tempe, AZ (US), recognized for his contributions to the field of semiconductor technology. With a total of 3 patents to his name, Elias has made significant advancements in chemical-mechanical polishing processes and semiconductor die attachment methods.

Latest Patents

One of Elias's latest patents is the "Lot-to-lot feed forward CMP process." This invention relates to a chemical-mechanical polishing process that performs polishing on an entire wafer lot without look-ahead polishing of a first article wafer. The process includes determining a normalized polish rate and predicting the process time for the next wafer lot using this rate. Another significant patent is the "Semiconductor die attach method and apparatus therefor." This invention features a semiconductor die bonder equipped with a height adjuster that ensures the die bonding head positions a semiconductor die at the desired bond line thickness.

Career Highlights

Throughout his career, Russell J Elias has worked with prominent companies such as Motorola Corporation and Cypress Semiconductor Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Elias has collaborated with notable individuals in the industry, including Eugene C Smith and Martin J Briehl. These collaborations have likely enriched his work and led to further advancements in his field.

Conclusion

Russell J Elias is a distinguished inventor whose work in semiconductor technology has led to valuable patents and innovations. His contributions continue to impact the industry positively.