The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
May. 04, 1998
Applicant:
Inventors:
Martin J. Briehl, Scottsdale, AZ (US);
Russell J. Elias, Tempe, AZ (US);
Douglas L. Glover, Phoenix, AZ (US);
Marjorie S. Errickson, Tempe, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ;
Abstract
A semiconductor die bonder (,) has a height adjuster (,) that is positioned next to the die bonding head (,). The height adjuster (,) assist in ensuring that die bonding head (,) positions a semiconductor die (,) at the desired bond line thickness.