Motorola Corporation

Cypress Semiconductor Corporation

Russell J Elias

Frederick Y Cho

Douglas L Glover

James F Landers

Martin J Briehl

Eugene C Smith

Marjorie S Errickson

One embodiment disclosed relates to a chemical-mechanical polishing process. The process includes performing chemical-mechanical polishing on an entire wafer lot without look ahead polishing of a first article wafer. A normalized polish rate is determined, and a process time for a next wafer lot is predicted using the normalized polish rate. Another embodiment of the invention relates to a polishing apparatus for chemical-mechanical planarization of semiconductor wafers.

Lot-to-lot feed forward CMP process

A semiconductor die bonder (,) has a height adjuster (,) that is positioned next to the die bonding head (,). The height adjuster (,) assist in ensuring that die bonding head (,) positions a semiconductor die (,) at the desired bond line thickness.

Semiconductor die attach method and apparatus therefor

A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a rigid planar substrate and having metallization on both sides. The method also includes steps of drilling through holes in the substrate and plating the through holes with a metal. The method also includes steps of preparing a patterned photoresist layer on at least one of the two sides, etching the metallization on the at least one side in accordance with the patterned photoresist layer, drilling support holes, filling the support holes with a material chemically distinct from the substrate, stripping the patterned photoresist layer from the at least one side and chemically removing the substrate from the metallization.

Method for manufacturing a light weight circuit module

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Tempe, AZ, United States of America

Russell J Elias