This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Innovations of Ruoh-Huey Wang in Wafer Level Packaging
Introduction
Ruoh-Huey Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to wafer level packages. His work focuses on enhancing the reliability and efficiency of semiconductor devices.
Latest Patents
One of Ruoh-Huey Wang's key patents is titled "Wafer level package incorporating elastomeric pads in dummy plugs." This patent describes a method for forming a wafer level package by incorporating an insulating pad made of elastic material under a dummy plug. The process involves creating multiple pads or islands of elastic material on a pre-processed semiconductor substrate before forming dummy via plugs on top. These dummy plugs serve as a support structure for building I/O redistribution lines, which are essential for connecting solder bumps or solder balls. The insulating pads provide stress relief during the bonding process, preventing the common issue of cracking that can occur with traditional methods. This innovative approach offers numerous processing advantages, including the elimination of direct contact between the elastomeric material layer and the polyimide passivation layer, thereby reducing the risk of cracking and breaking in I/O redistribution lines.
Career Highlights
Ruoh-Huey Wang is associated with the Industrial Technology Research Institute, where he continues to advance research in semiconductor technologies. His work has been instrumental in developing new methods that improve the performance and reliability of electronic devices.
Collaborations
He has collaborated with notable colleagues such as Szu-Wei Lu and Kuo-Chuan Chen, contributing to various projects that enhance the field of semiconductor packaging.
Conclusion
Ruoh-Huey Wang's innovative contributions to wafer level packaging demonstrate his commitment to advancing semiconductor technology. His patent on incorporating elastomeric pads in dummy plugs is a testament to his ingenuity and dedication to improving electronic device reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile