This inventor holds 1 USPTO granted patent. Top assignee: St Assembly Test Services Inc.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Rufino Ringor and the Ground Pin Concept for Singulated Ball Grid Arrays.
Introduction
Rufino Ringor is an inventor associated with Singapore. His patent work addresses testing ball grid array (BGA) devices, with a focus on providing a ground connection without interfering with critical areas of the package surface.
Latest Patents
Ringor is credited with 1 patent: “Ground Pin Concept for Singulated Ball Grid Array.” The invention describes a ground pin that can be placed in an area of a BGA package that avoids critical surface regions. The approach can also be extended to use multiple ground pins.
Career Highlights
Ringor is associated with ST Assembly Test Services Inc. His patent reflects work on practical test-fixture design for BGA devices, where ground-pin placement can support testing while preserving access to important package areas.
Collaborations
The provided information lists Fortunato V. Lopez and Dexter Inciong Reynoso as Ringor’s coworkers. It does not specify their roles in the patent or whether they collaborated directly on the invention.
Conclusion
Rufino Ringor’s patent presents a flexible ground-pin concept for testing singulated BGA devices, combining careful placement with the option to use multiple pins.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile