Company Filing History:
Years Active: 2011-2017
Title: The Innovative Contributions of Ruben C. Zeta
Introduction
Ruben C. Zeta is a notable inventor based in Milpitas, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of five patents. His work focuses on enhancing the security and efficiency of electronic components.
Latest Patents
One of his latest patents is for an integrated circuit package featuring surface-mount blocking elements. This innovative design includes a first cavity-down ball grid array (BGA) package that consists of a substrate member and an array of bond balls. The bond balls are organized into parallel extending rows of outer mesh bond balls and a row of inner signal bond balls. A surface-mount blocking element is strategically placed between these rows to provide additional protection. This element can be either a passive or active component of the BGA package. In a practical application, this first cavity-down BGA package can be surface-mounted to a second cavity-down BGA package, forming a package-on-package (POP) security module. This design effectively creates a physical barrier against unauthorized probing of the inner signal bond balls, thereby safeguarding sensitive data.
Career Highlights
Ruben C. Zeta is currently employed at Maxim Integrated Products, Inc., where he continues to innovate in the field of electronic packaging. His expertise and contributions have positioned him as a key figure in the development of secure electronic components.
Collaborations
Throughout his career, Zeta has collaborated with talented individuals such as Edgardo L. Chua Ching Chua and David D. Eaton. These collaborations have further enriched his work and contributed to the advancement of technology in his field.
Conclusion
Ruben C. Zeta's innovative work in integrated circuit packaging has made a significant impact on the industry. His patents reflect a commitment to enhancing security and efficiency in electronic components. His contributions will continue to influence the future of technology.