The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Apr. 13, 2007
Steven M. Pope, Los Gatos, CA (US);
Ruben C. Zeta, Milpitas, CA (US);
Steven M. Pope, Los Gatos, CA (US);
Ruben C. Zeta, Milpitas, CA (US);
Maxim Integrated Products, Inc., Sunnyvale, CA (US);
Abstract
A package-on-package (POP) secure module includes a first ball grid array (BGA) package and a second BGA package. The first BGA includes an array of bond balls that is disposed on a side of a substrate member, and an array of lands that is disposed on the opposite side of the substrate member. Bond balls of the second BGA are fixed to the lands of the first BGA such that the second BGA is piggy-back mounted to the first BGA. Embedded in the substrate member of the second BGA is an anti-tamper security mesh. An integrated circuit in the first BGA is coupled to, drives and monitors the security mesh. When the module is disposed on a printed circuit board within a point of sale (POS) terminal, the integrated circuit is coupled to, also drives and monitors a second security mesh embedded in the printed circuit board underneath the module.