The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
May. 03, 2007
Ruben C. Zeta, Milpitas, CA (US);
Ruben C. Zeta, Milpitas, CA (US);
Maxim Integrated Products, Inc., Sunnyvale, CA (US);
Abstract
An integrated circuit (IC) package includes a printed circuit board (PCB) substrate and a plurality of package attachment terminals. The package attachment terminals are used to conduct electrical signals from a die that is attached and bonded onto the PCB substrate. The PCB substrate has a side edge and includes a plurality of electrically-conductive paths. Each one of the plurality of paths includes an electroplated bond pad, a trace, and a stub trace. The die is connected to the bond pad and the trace couples the bond pad to a respective one of the package attachment terminals. The stub trace is used to facilitate the electroplating process. The stub trace extends from the trace and terminates at a distance away from the side edge. The stub trace is not visible from the side of the IC package and therefore prevents access to IC buses on the package.