This inventor holds 1 USPTO granted patent. Top assignee: Viasystems, Inc.. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Roy J Lecesse: Innovator in Circuit Board Technology
Introduction
Roy J Lecesse is a notable inventor based in St. Louis, MO (US). He has made significant contributions to the field of circuit board technology, particularly with his innovative approach to constructing printed circuit boards.
Latest Patents
Roy J Lecesse holds a patent for a "Circuit board multi-functional hole system and method." This invention outlines a method and system for constructing a printed circuit board with multifunctional holes. The process involves depositing a first conductive material into a hole in a substrate to create a first plating on the inner surface of the hole. The outer portion of the hole is then modified to have a larger diameter, allowing for the removal of the first conductive material from that area. A seed material is subsequently deposited into the modified hole, followed by the application of an etchant to non-mechanically remove the first conductive material from the unmodified portion. Finally, another conductive material is deposited into the modified hole, adhering to the seed material to form a second plating at the outer portion. Roy J Lecesse has 1 patent to his name.
Career Highlights
Roy J Lecesse is associated with Viasystems, Inc., where he applies his expertise in circuit board technology. His work has contributed to advancements in the manufacturing processes of printed circuit boards, enhancing their functionality and efficiency.
Collaborations
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Conclusion
Roy J Lecesse's innovative work in circuit board technology exemplifies the impact of inventors in advancing engineering solutions. His contributions continue to influence the industry and pave the way for future innovations.