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For the Inventor, By the Inventor

St. Louis, MO, United States of America

Viasystems, Inc.


USPTO Granted Patents = 3

% Expired Patents = 33.3


Trademarks = 8

Forward Citations = 15

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4 inventors (with patents filed for the assignee):

goldMedal Pamela L Miscikowski (2 out of 2 patents)

silverMedal Roy J Lecesse (1 out of 1 patent)

bronzeMedal John LeRoy Parker (1 out of 2 patents)

4.  John L Parker, Jr (1 out of 1 patent)

5.  Adam Sorensen (0 patent)

6.  Bruce Lewis (0 patent)


3 patents:

1. 9526184 - Circuit board multi-functional hole system and method (2016-12-20),
2. 6598291 - Via connector and method of making same (2003-07-29),
3. 6303881 - Via connector and method of making same (2001-10-16),
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USPTO Data Jan 1 1976 - Oct 6 2026

3 Patents

#399 in St. Louis, MO

#1,026 in Missouri

#73,815 in US

St. Louis, MO (US)
St. Louis, MO, United States of America

Viasystems, Inc.

Forward Citations = 15

4 inventors:

goldMedal Pamela L Miscikowski (2 out of 2 patents)

silverMedal Roy J Lecesse (1 out of 1 patent)

bronzeMedal John LeRoy Parker (1 out of 2 patents)

4.  John L Parker, Jr (1 out of 1 patent)

5.  Adam Sorensen (0 patent)

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