Company Filing History:
1 out of 101 
1 out of 14 Years Active: 2022
Title: Ronghong Ye: Innovator in Semiconductor Manufacturing
Introduction
Ronghong Ye is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 2 patents. His innovative approaches have advanced the technology used in the production of integrated circuits.
Latest Patents
Ronghong Ye's latest patents include a method for manufacturing a 14nm-node BEOL 32nm-width metal. This method provides a semiconductor structure that includes a carbon coating and an intermediate layer. The process involves forming a photoresist layer, exposing it according to a layout, and developing it to create a peg groove. This innovative technique reduces the longitudinal shrink of the metal wire, improves uniformity, and increases the effective usable area of a chip.
Another notable patent is related to FinFET technology and its manufacturing method. This method includes generating an interlayer dielectric layer, a metal hard mask, and a tri-layer mask on a gate. The process allows for accurate control of the critical dimensions of the contact in both the X and Y directions, enhancing the precision of semiconductor devices.
Career Highlights
Ronghong Ye has worked with notable companies in the semiconductor industry, including Shanghai Huali Integrated Circuit Corporation and Shanghai Huali Integrated Circuit Manufacturing Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Ronghong Ye has collaborated with talented individuals in his field, including Yongji Mao and Liyao Liu. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Ronghong Ye's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of integrated circuit technology.