This inventor holds 1 USPTO granted patent. Top assignee: Burroughs, Inc.. Active years: 1981.
Company Filing History:
Years Active: 1981
Title: The Innovative Contributions of Ronald J. Ritchie
Introduction
Ronald J. Ritchie is a notable inventor based in La Mesa, CA (US). He has made significant contributions to the field of integrated circuit packaging. His work has led to advancements that enhance the efficiency and performance of electronic devices.
Latest Patents
Ritchie holds a patent for an "IC Package with heat sink and minimal cross-sectional area." This invention discloses an integrated circuit (IC) package designed to connect one set of nodes on an IC chip to another corresponding set of nodes on a circuit board. Each interconnection is made with a single C-shaped lead, which is bonded at one end to a node on the chip. These leads extend outward from the periphery of the chip's surface, then perpendicular to and away from the chip's surface, and then inwards towards each other. A heat sink attaches to the back of the chip, and the chip, an adjacent portion of the heat sink, and the outward extending portion of the leads are encapsulated with a solid mass to hold them rigidly in place. Ritchie has 1 patent to his name.
Career Highlights
Ronald J. Ritchie has had a successful career at Burroughs, Inc., where he has contributed to various projects and innovations. His expertise in integrated circuit technology has made him a valuable asset to the company.
Collaborations
Ritchie has worked alongside his coworker, Daniel Marshall Andrews, contributing to the development of innovative solutions in the field of electronics.
Conclusion
Ronald J. Ritchie's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patent reflects a significant advancement in the efficiency of electronic devices, showcasing his role as a key inventor in the industry.