Burroughs, Inc.

Ronald J Ritchie

Daniel Marshall Andrews

Disclosed is an IC package for connecting one set of nodes on an IC chip to another corresponding set of nodes on a circuit board. Each interconnection is made with a single C-shaped lead which is bonded at one end to a node on the chip. These leads extend outward from the periphery of the chip's surface, then perpendicular to and away from the chip's surface, and then inwards towards each other. A heat sink attaches to the back of the chip. The chip, an adjacent portion of the heat sink, and the outward extending portion of the leads are then encapsulated with a solid mass to hold them rigidly in place.

Growing community of inventors

La Mesa, CA, United States of America

Ronald J Ritchie