Location History:
- Winston-Salme, NC (US) (1991)
- Winston-Salem, NC (US) (1985 - 1992)
Company Filing History:
Years Active: 1985-1992
Title: The Innovations of Ronald A. Dery
Introduction
Ronald A. Dery is a notable inventor based in Winston-Salem, NC (US), recognized for his contributions to electrical interconnection technologies. With a total of 12 patents to his name, Dery has made significant advancements in the field of connectors and circuit board interconnections.
Latest Patents
Among his latest innovations is the "High Density Backplane Connector." This invention features a high-density connector designed for electrically interconnecting conductive paths on closely spaced circuit boards. The connector includes a clamping mechanism that compresses springs to drive flat flexible circuits, ensuring reliable engagement with board circuit paths. Another significant patent is the "Canted Coil Spring Interposing Connector," which establishes electrical interconnections between opposing surfaces using canted coil springs. These springs provide a constant compliance and produce contact wipe over conductive areas, enhancing the reliability of the connections.
Career Highlights
Dery's career is marked by his work at Amp LLC, where he has been instrumental in developing innovative connector solutions. His expertise in electrical interconnections has positioned him as a key figure in the industry, contributing to advancements that improve the performance and reliability of electronic devices.
Collaborations
Throughout his career, Dery has collaborated with notable colleagues, including Warren C. Jones and Albert Casciotti. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the field of electrical connectors.
Conclusion
Ronald A. Dery's contributions to the field of electrical interconnections through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the industry and pave the way for future innovations.