The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 1987

Filed:

Aug. 27, 1985
Applicant:
Inventors:

Ronald A Dery, Winston-Salem, NC (US);

Warren C Jones, Winston-Salem, NC (US);

Assignee:

AMP Incorporated, Harrisburg, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ; H01R / ; H01R / ; H02G / ;
U.S. Cl.
CPC ...
174 / ; 156 52 ; 174 / ; 1741 / ; 1741 / ;
Abstract

An adhesive interconnecting means is comprised of one or more conductors on an insulating substrate, a first adhesive layer, said first layer being anisotropically conductive and disposed over said conductors and substrate and a second adhesive layer said second layer being a flowable adhesive that extends over the first substrate and anisotropically conductive layer. The anisotropically conductive adhesive is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder; the conductive particles, of random size and shape, are dispersed randomly throughout the mixture in noncontiguous conductive units, each unit being comprised of one or more individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. The flowable adhesive extends over the surface of the first substrate and conductive units to provide insulation whereby upon positioning the first substrate conductors in an overlapping conducting relationship to the second substrate conductors and applying pressure to the positioned areas, the adhesive flows from the positioned areas and exposes the conductive units thus bringing the exposed units into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface of the surface of the second substrate.


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