Amp LLC

Ronald A Dery

Warren C Jones

Albert Casciotti

Frederick R Deak

Richard Henry Zimmerman

John R Rowlette

William J Lynn

David B Wrisley, Jr

William G Gentry

Clifton C May, Jr

David J Goetzinger

Steven G Wentink

A high density connector (10) for electrically interconnecting conductive paths (14, 84) on close centers between circuit boards such as those of a backpanel (82) and daughter cards (12), includes a clamping mechanism (18, 20) bolted first to a daughter card and then to a backpanel to compress springs (46, 48, 50) held by the mechanism driving flat flexible circuits (52) having contacts (68, 70) on close centers to engage board circuit paths, where the mechanism (18, 20) is rigid and includes spring driven clamps (42) to straighten the daughter card and strain relief the interconnection area. The flexible circuit contacts (68, 70) are offset relative to the springs (48, 50) bearing area to provide a contact wipe of the contact path interconnection.

High density backplane connector

An interposing connector for interconnecting a pattern of conductive areas of opposing spaced apart surfaces. The connector includes a housing having one or more openings therethrough. A plurality of canted coil springs are positioned within the housing so that outer coil portions are exposed to engage the conductive areas of the opposing surfaces to thereby establish the electrical interconnection. The canted coil springs are secured to the housing by retaining means, such as a retainer strip extending through the springs and secured to the housing. The springs may also be secured by heat staking or laser welding a portion thereof to the housing. The canted coil springs have a relatively constant compliance over a range of radial deflection. The springs also produce contact wipe over the conductive areas and establish redundant contact points therewith.

Canted coil spring interposing connector

An electrical connector (10,50,50',84,84') for being positioned between parallel surfaces and electrically interconnecting conductive areas on the surfaces is disclosed. More particularly, the connector (10,50,50',84,84') includes a housing (12,52,52',86) and contact elements (14,14',14',70,104) which are formed by wrapping a flexible, circuit carrying film (20,72) around a single canted coil spring (18) or by wrapping a flexible circuit carrying film (104) around two spaced apart canted coil springs (18).

Electrical connector for electrically interconnecting two parallel

An area array connector (10) for electrically interconnecting circuit pads (18,20) on spaced apart, substrates (22,24) is disclosed. The connector (10) includes a carrier plate (12) having canted coil spring contacts (16) positioned in openings (14) for electrically interconnecting corresponding circuit pads (18,20) on the respective substrates (22,24) between which the connector (10) is placed.

Area array connector for substrates

An electrical connector (18) for electrically interconnecting non-parallel substrates (10,12) is disclosed. The connector (18) includes a contact element (24) formed from a single length of flexible, circuit carrying film (40) wrapped around two or more spaced apart coil springs (42) with each wrapped spring provided a segment (60). The contact element (24) is carried in a housing (20) with the segments (60) received in interconnected channels (26) in adjacent surfaces (28) of the housing against which the substrates (10,12) are mounted for electrical engagement with the segments (60).

Electrical connector for electrically interconnecting non-parallel

Polymeric electrically conductive apparatus such as electric connectors are disclosed. These connectors employ a polymeric conductive material such as a conductive epoxy having conductive particles dispersed therein sufficient to establish electrical conductivity. These conductive materials are at least initially deformable such that electrical conductors may be inserted within an envelope containing the conductive material and electrical continuity for a prescribed circuit can be verified before structurally affixing the conductors to the envelope. Embodiments having radially collapsible envelopes for forming splice connectors and multicontact configurations employing rigid dielectric housings are disclosed.

Polymeric electrical interconnection apparatus and method of use

An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18). The units (24) are sufficiently spaced apart, however, to preclude electrical conductivity between adjacent areas on the same substrate. A method for electrically connecting conductive areas on two substrates by means of said anisotropically conductive adhesive composition (10) and products produced by said method are also disclosed.

Anisotropically conductive adhesive composition

A flat multiconductor cable having a multilayer construction and especially suited for use in establishing interconnections between the cable conductors and a separate conductive array such as a similar flat cable is disclosed. Conductive ink, formed metal conductors or etched conductors can be deposited on a flexible substrate and covered by a dielectric covering in the form of an ultraviolet cured dielectric coating or a separate insulating film. The conductors can be covered by anisotropic conductive adhesive with the conductive adhesive in contact with the underlying conductors at exposed tap locations where no dielectric coating is deposited or where the dielectric coating has been removed. A separate conductive array can be positioned in registry with the tap locations and the conductive adhesive can be used both to secure the conductive array to the cable and to establish electrical continuity between corresponding conductors.

Flexible flat multiconductor cable

An adhesive interconnecting means is comprised of one or more conductors on an insulating substrate, a first adhesive layer, said first layer being anisotropically conductive and disposed over said conductors and substrate and a second adhesive layer said second layer being a flowable adhesive that extends over the first substrate and anisotropically conductive layer. The anisotropically conductive adhesive is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder; the conductive particles, of random size and shape, are dispersed randomly throughout the mixture in noncontiguous conductive units, each unit being comprised of one or more individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. The flowable adhesive extends over the surface of the first substrate and conductive units to provide insulation whereby upon positioning the first substrate conductors in an overlapping conducting relationship to the second substrate conductors and applying pressure to the positioned areas, the adhesive flows from the positioned areas and exposes the conductive units thus bringing the exposed units into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface of the surface of the second substrate.

Adhesive electrical interconnecting means

An interconnecting means is comprised of one or more conductive ink conductors screen printed onto a first substrate, the conductive ink being comprised of an insulating polymer medium having first and second groups of conductive particles therein, and an insulating layer of flowable adhesive in covering relationship to the conductors. The first group of particles are finely divided particles which are suspended in the medium and form a continuous conductive path along the length of the conductor. The second group of particles are agglomerates of large particles which are randomly scattered throughout the conductive path and project above the surface of the medium. Interconnection is effected by positioning the first substrate conductors in an overlapping conducting relationship to the conductors on the second substrate such that the flowable adhesive is deposited between the two substrates and applying pressure to the positioned conductors and surrounding areas. The adhesive flows from the positioned areas, exposes the protruding agglomerates, thus bringing the agglomerates into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

Electrical interconnection means

An adhesive interconnecting means is comprised of one or more conductors on an insulating substrate, a first adhesive layer, said first layer being anisotropically conductive and disposed over said conductors and substrate and a second adhesive layer said second layer being a flowable adhesive that extends over the first substrate and anisotropically conductive layer. The anisotropically conductive adhesive is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder; the conductive particles, of random size and shape, are dispersed randomly throughout the mixture in noncontiguous conductive units, each unit being comprised of one or more individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. The flowable adhesive extends over the surface of the first substrate and conductive units to provide insulation whereby upon positioning the first substrate conductors in an overlapping conducting relationship to the second substrate conductors and applying pressure to the positioned areas, the adhesive flows from the positioned areas and exposes the conductive units thus bringing the exposed units into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

Method of making adhesive electrical interconnecting means

An interconnecting means is comprised of one or more conductive ink conductors printed onto a first substrate, the conductive ink being comprised of an insulating polymer medium having first and second groups of conductive particles therein, and an insulating layer of flowable adhesive in covering relationship to the conductors. The first group of particles are finely divided particles which are suspended in the medium and form a continuous conductive path along the length of the conductor. The second group of particles are agglomerates of large particles which are randomly scattered throughout the conductive path and project above the surface of the medium. Interconnection is effected by positioning the first substrate conductors in an overlapping conducting relationship to the conductors on the second substrate such that the flowable adhesive is deposited between the two substrates and applying pressure to the positioned conductors and surrounding areas. The adhesive flows from the positioned areas, exposes the protruding agglomerates, thus bringing the agglomerates into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

Growing community of inventors

Winston-Salem, NC, United States of America

Ronald A Dery