Company Filing History:
Years Active: 2003-2004
Title: Romony K San: Innovator in Semiconductor Technology
Introduction
Romony K San is a notable inventor based in Vancouver, WA (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that focus on improving wafer manufacturing processes.
Latest Patents
His latest patents include "Methods and apparatus for predicting oxygen-induced stacking fault density in wafers." This invention presents a method for predicting the density of oxygen-induced stacking faults (OSF) on a wafer's surface by measuring surface roughness before and after a damaging process. The process can involve various techniques such as wet sand blasting, dry sand blasting, lapping, surface grinding, and laser irradiation. The invention quantifies the surface roughness resulting from damage and correlates it with OSF density, providing a predictive evaluation of wafer quality.
Another significant patent is "Double side polished wafers having external gettering sites, and method of producing same." This patent describes a semiconductor wafer manufacturing process that results in a double side polished wafer with oxygen-induced stacking faults, which provide extrinsic gettering on the wafer's back surface. The process involves polishing the back surface, depositing a thin polysilicon film, and subjecting the wafer to thermal oxidation, ultimately leading to the creation of extrinsic gettering sites.
Career Highlights
Romony K San is currently associated with SEH America, Inc., where he applies his expertise in semiconductor technology. His work has contributed to advancements in wafer manufacturing and quality assessment.
Collaborations
He has collaborated with notable colleagues such as Timothy L Brown and David A Beauchaine, further enhancing the innovative efforts within his field.
Conclusion
Romony K San's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced manufacturing processes for semiconductor wafers.