Company Filing History:
Years Active: 2003
Title: Rolf Schuermann: Innovator in Die Bonding Technology
Introduction
Rolf Schuermann is a notable inventor based in Singapore, SG. He has made significant contributions to the field of die bonding technology. With a focus on innovation, Rolf has developed a unique device that enhances the efficiency of substrate handling in manufacturing processes.
Latest Patents
Rolf Schuermann holds 1 patent for his invention titled "Die bonder and/or wire bonder with a device for holding down a substrate." This innovative device features a table with drill holes that are mechanically programmable. The programmability allows for the application of vacuum to the drill holes, enabling quick and easy adaptation to various substrates. This advancement streamlines the bonding process, making it more versatile and efficient.
Career Highlights
Rolf is currently employed at Esec Trading Sa, where he continues to push the boundaries of technology in the semiconductor industry. His work has been instrumental in improving the reliability and performance of bonding equipment. Rolf's dedication to innovation has positioned him as a key player in his field.
Collaborations
Throughout his career, Rolf has collaborated with talented professionals, including Stefan Behler and Beat Zumbuehl. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Rolf Schuermann's contributions to die bonding technology exemplify his commitment to innovation and excellence. His patented device represents a significant advancement in the industry, showcasing his ability to solve complex challenges in substrate handling. Rolf's work continues to influence the future of manufacturing processes.