The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2003
Filed:
Dec. 04, 2001
Applicant:
Inventors:
Stefan Behler, Steinhausen, CH;
Beat Zumbuehl, Rotkreuz, CH;
Reto Schubiger, Ebikon, CH;
Ruedi Grueter, Neuenkirch, CH;
Rolf Schuermann, Singapore, CH;
Assignee:
ESEC Trading SA, Cham, CH;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B25B 1/100 ; B23K 5/22 ;
U.S. Cl.
CPC ...
B25B 1/100 ; B23K 5/22 ;
Abstract
A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.