This inventor holds 3 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Future Wei Technologies, Inc.. Active years: 2014-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014-2015
Title: Rohit Sunkam Ramanujam: Innovator in On-Chip Network Technologies
Introduction
Rohit Sunkam Ramanujam is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of on-chip network technologies, holding a total of 3 patents. His work focuses on improving the efficiency and performance of interconnect systems in integrated circuits.
Latest Patents
Rohit has developed several innovative patents, including:
1. **Asymmetric ring topology for reduced latency in on-chip ring networks** - This patent describes an apparatus comprising a chip with multiple nodes connected by two distinct ring networks, each featuring a different topology to enhance performance.
2. **Method and apparatus for achieving fairness in interconnect using age-based arbitration and timestamping** - This invention involves a chip with multiple nodes that can prioritize data transmission based on the age of the data, ensuring efficient communication between nodes.
Career Highlights
Rohit has worked with prominent companies in the technology sector, including Future Wei Technologies, Inc. and Huawei Technologies Co., Limited. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge innovations in the field.
Collaborations
Rohit has collaborated with talented individuals such as Sailesh Kumar and William C. Lynch. These partnerships have fostered a creative environment that has led to the development of impactful technologies.
Conclusion
Rohit Sunkam Ramanujam is a distinguished inventor whose work in on-chip network technologies has paved the way for advancements in integrated circuit design. His innovative patents and collaborations highlight his commitment to enhancing the efficiency of interconnect systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
