Rohit Dikshit

Title: Rohit Dikshit: Innovator in Semiconductor Technology

Introduction

Rohit Dikshit is a prominent inventor based in Herriman, UT (US), known for his contributions to semiconductor technology. With a total of three patents to his name, he has made significant advancements in the field, particularly in power MOSFETs and semiconductor die fabrication.

Latest Patents

One of his latest patents is the Double Layer Metal (DLM) Power MOSFET. This patent discusses a semiconductor device that includes a first metal layer coupled to a source region and a second metal layer coupled to a gate structure, wherein at least a portion of the first and second metal layers overlap vertically. Another notable patent is related to semiconductor die containing lateral edge shapes and textures. This document describes methods for singulating a semiconductor wafer into individual dies that feature lateral edges or sidewalls. The semiconductor dies formed from these methods utilize a front-to-back photolithography alignment process to create a photo-resist mask and employ an anisotropic wet etch in an HNA and/or TMAH solution to achieve sloped sidewalls and textures.

Career Highlights

Rohit Dikshit is currently employed at Fairchild Semiconductor Corporation, where he continues to innovate and develop new technologies in the semiconductor industry. His work has contributed to advancements that enhance the performance and efficiency of semiconductor devices.

Collaborations

Throughout his career, Rohit has collaborated with notable colleagues, including Michael D Gruenhagen and Suku Kim. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Rohit Dikshit is a key figure in the semiconductor industry, with a focus on innovative technologies that improve device performance. His patents and collaborations reflect his commitment to advancing semiconductor technology.